Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium (2019)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2018.11.097
Publication URI: http://dx.doi.org/10.1016/j.jallcom.2018.11.097
Type: Journal Article/Review
Parent Publication: Journal of Alloys and Compounds