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Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints (2018)

First Author: Belyakov S

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s10854-018-0302-8

Publication URI: http://dx.doi.org/10.1007/s10854-018-0302-8

Type: Journal Article/Review

Parent Publication: Journal of Materials Science: Materials in Electronics

Issue: 1