Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder (2018)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-018-6744-1
Publication URI: http://dx.doi.org/10.1007/s11664-018-6744-1
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 1