The thickness and material optimization of flexible electronic packaging for functional electronic textile (2018)

First Author: Li M
Attributed to:  Novel manufacturing methods for functional electronic textiles funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/dtip.2018.8394186

Publication URI: http://dx.doi.org/10.1109/dtip.2018.8394186

Type: Conference/Paper/Proceeding/Abstract