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An automated process for inclusion of package dies and circuitry within a textile yarn (2018)

First Author: Hardy D

Attributed to: Novel manufacturing methods for functional electronic textiles funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/dtip.2018.8394189

Publication URI: http://dx.doi.org/10.1109/dtip.2018.8394189

Type: Conference/Paper/Proceeding/Abstract