Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film (2017)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.4071/imaps.521776
Publication URI: http://dx.doi.org/10.4071/imaps.521776
Type: Journal Article/Review
Parent Publication: Journal of Microelectronics and Electronic Packaging
Issue: 4