Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film (2017)

First Author: Dai J
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC


No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.4071/imaps.521776

Publication URI: http://dx.doi.org/10.4071/imaps.521776

Type: Journal Article/Review

Parent Publication: Journal of Microelectronics and Electronic Packaging

Issue: 4