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Thermal and thermo-mechanical design of an integrated substrate and heat sink for planar power module (2018)

First Author: Li J.
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://ieeexplore.ieee.org/document/8403165

Type: Conference/Paper/Proceeding/Abstract