The First-Priniple Simulation Study on the Specific Grain Boundary Resistivity in Copper Interconnects (2018)
Attributed to:
Quantum Electronics Device Modelling (QUANTDEVMOD)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/nmdc.2018.8605907
Publication URI: http://dx.doi.org/10.1109/nmdc.2018.8605907
Type: Conference/Paper/Proceeding/Abstract