Growth of ß intermetallic in an Al-Cu-Si alloy during directional solidification via machine learned 4D quantification (2019)
Attributed to:
Disruptive Solidification Microstructures via Thermoelectric Control
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Publication URI: http://www.elsevier.com/locate/scriptamat
Type: Journal Article/Review
Volume: 165
Parent Publication: Scripra Materialia