Thermosonic-Adhesive (TS-A) Integration of Flexible Integrated Circuits on Flexible Plastic Substrates (2018)

First Author: Dou G
Attributed to:  EPSRC Centre for Innovative Manufacturing in Large Area Electronics funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546458

Publication URI: http://dx.doi.org/10.1109/estc.2018.8546458

Type: Conference/Paper/Proceeding/Abstract