Automated insertion of package dies onto wire and into a textile yarn sheath (2019)
Attributed to:
Novel manufacturing methods for functional electronic textiles
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s00542-019-04361-y
Publication URI: http://dx.doi.org/10.1007/s00542-019-04361-y
Type: Journal Article/Review
Parent Publication: Microsystem Technologies
Issue: 6