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A Numerical Procedure for the Optimization of IGBT Module Packaging (2018)

First Author: Lu H

Attributed to: Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/icept.2018.8480746

Publication URI: http://dx.doi.org/10.1109/icept.2018.8480746

Type: Conference/Paper/Proceeding/Abstract