A Numerical Procedure for the Optimization of IGBT Module Packaging (2018)
Attributed to:
Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/icept.2018.8480746
Publication URI: http://dx.doi.org/10.1109/icept.2018.8480746
Type: Conference/Paper/Proceeding/Abstract