Study on lifetime prediction considering fatigue accumulative effect for die-attach solder layer in an IGBT module (2018)
Attributed to:
Vehicle Electrical Systems Integration (VESI)
funded by
UKRI
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1002/tee.22607
Publication URI: http://dx.doi.org/10.1002/tee.22607
Type: Journal Article/Review
Parent Publication: IEEJ Transactions on Electrical and Electronic Engineering
Issue: 4
ISSN: 19314981 19314973