Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables (2018)

First Author: Rajaguru P
Attributed to:  Underpinning Power Electronics 2012: Devices Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2018.02.024

Publication URI: http://dx.doi.org/10.1016/j.microrel.2018.02.024

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

ISSN: 00262714