Revealing Spider Silk's 3D Nanostructure Through Low Temperature Plasma Etching and Advanced Low-Voltage SEM (2019)
Attributed to:
SPICE: Silk Processing In Controlled Environments
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.3389/fmats.2018.00084
Publication URI: http://dx.doi.org/10.3389/fmats.2018.00084
Type: Journal Article/Review
Parent Publication: Frontiers in Materials