Revealing Spider Silk's 3D Nanostructure Through Low Temperature Plasma Etching and Advanced Low-Voltage SEM (2019)

First Author: Stehling N
Attributed to:  SPICE: Silk Processing In Controlled Environments funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.3389/fmats.2018.00084

Publication URI: http://dx.doi.org/10.3389/fmats.2018.00084

Type: Journal Article/Review

Parent Publication: Frontiers in Materials