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Packaging of Silicon Microlenses on Integrated OAM-Emitters for Compact Transmitters (2018)

First Author: Malik M

Attributed to: High Dimensional Free-space Building-to-Building Link for Last-Mile Communications funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ecoc.2018.8535285

Publication URI: http://dx.doi.org/10.1109/ecoc.2018.8535285

Type: Conference/Paper/Proceeding/Abstract