📣 Help Shape the Future of UKRI's Gateway to Research (GtR)

We're improving UKRI's Gateway to Research and are seeking your input! If you would be interested in being interviewed about the improvements we're making and to have your say about how we can make GtR more user-friendly, impactful, and effective for the Research and Innovation community, please email gateway@ukri.org.

Interaction effects between the preferred growth of ß-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling (2018)

First Author: Liang S

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546386

Publication URI: http://dx.doi.org/10.1109/estc.2018.8546386

Type: Conference/Paper/Proceeding/Abstract