Copper-based Graphene Nanoplatelet Composites as Interconnect for Power Electronics Pacakging (2018)

First Author: Wang J
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546493

Publication URI: http://dx.doi.org/10.1109/estc.2018.8546493

Type: Conference/Paper/Proceeding/Abstract