An in situ Method for Preserving Buried Voids and Cracks During TEM Sample Preparation using FIB (2016)

First Author: Zhong X

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1017/s1431927616001781

Publication URI: http://dx.doi.org/10.1017/s1431927616001781

Type: Journal Article/Review

Parent Publication: Microscopy and Microanalysis

Issue: S3