An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method (2018)

First Author: Nwanoro K
Attributed to:  Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2018.05.013

Publication URI: http://dx.doi.org/10.1016/j.microrel.2018.05.013

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability