Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module (2019)

First Author: Rajaguru P
Attributed to:  Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2019.2891949

Publication URI: http://dx.doi.org/10.1109/tdmr.2019.2891949

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Device and Materials Reliability

Issue: 1