A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles (2019)
Attributed to:
Novel manufacturing methods for functional electronic textiles
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.3390/fib7020012
Publication URI: http://dx.doi.org/10.3390/fib7020012
Type: Journal Article/Review
Parent Publication: Fibers
Issue: 2