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Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. (2020)

First Author: Agyakwa P

Attributed to: Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1111/jmi.12803

PubMed Identifier: 31070241

Publication URI: http://europepmc.org/abstract/MED/31070241

Type: Journal Article/Review

Volume: 277

Parent Publication: Journal of microscopy

Issue: 3

ISSN: 0022-2720