Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. (2019)

First Author: Agyakwa P
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC


No abstract provided

Bibliographic Information

Digital Object Identifier:

PubMed Identifier: 31070241

Publication URI:

Type: Journal Article/Review

Parent Publication: Journal of microscopy

ISSN: 0022-2720