Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. (2019)

First Author: Agyakwa P
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1111/jmi.12803

PubMed Identifier: 31070241

Publication URI: http://europepmc.org/abstract/MED/31070241

Type: Journal Article/Review

Parent Publication: Journal of microscopy

ISSN: 0022-2720