Modified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing (2019)

First Author: Ojuroye O

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s00542-019-04455-7

Publication URI: http://dx.doi.org/10.1007/s00542-019-04455-7

Type: Journal Article/Review

Parent Publication: Microsystem Technologies

Issue: 6