Modified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing (2019)
Attributed to:
Novel manufacturing methods for functional electronic textiles
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s00542-019-04455-7
Publication URI: http://dx.doi.org/10.1007/s00542-019-04455-7
Type: Journal Article/Review
Parent Publication: Microsystem Technologies
Issue: 6