Formation and homogenisation of Sn Cu interconnects by self-propagated exothermic reactive bonding (2019)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.matdes.2019.107781
Publication URI: http://dx.doi.org/10.1016/j.matdes.2019.107781
Type: Journal Article/Review
Parent Publication: Materials & Design