Formation and homogenisation of Sn Cu interconnects by self-propagated exothermic reactive bonding (2019)

First Author: Zhu W
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.matdes.2019.107781

Publication URI: http://dx.doi.org/10.1016/j.matdes.2019.107781

Type: Journal Article/Review

Parent Publication: Materials & Design