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Dynamic characterization of SiC and GaN devices with BTI stresses (2019)

First Author: Ortiz Gonzalez J

Attributed to: Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2019.06.081

Publication URI: http://dx.doi.org/10.1016/j.microrel.2019.06.081

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability