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Formation and Healing of Defects in Atomically Thin GaSe and InSe. (2019)

First Author: Hopkinson DG

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1021/acsnano.8b08253

PubMed Identifier: 30946569

Publication URI: http://europepmc.org/abstract/MED/30946569

Type: Journal Article/Review

Volume: 13

Parent Publication: ACS nano

Issue: 5

ISSN: 1936-0851