In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint (2020)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.scriptamat.2019.09.003
Publication URI: http://dx.doi.org/10.1016/j.scriptamat.2019.09.003
Type: Journal Article/Review
Parent Publication: Scripta Materialia