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Direct measurement of TEM lamella thickness in FIB-SEM. (2020)

First Author: Conlan AP

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1111/jmi.12852

PubMed Identifier: 31823368

Publication URI: http://europepmc.org/abstract/MED/31823368

Type: Journal Article/Review

Volume: 279

Parent Publication: Journal of microscopy

Issue: 3

ISSN: 0022-2720