3D Printed Interconnects on Bendable Substrates for 3D Circuits (2019)

First Author: Nassar H

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/FLEPS.2019.8792234

Publication URI: http://dx.doi.org/10.1109/FLEPS.2019.8792234

Type: Conference/Paper/Proceeding/Abstract