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Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy (2018)

First Author: Zhou Z

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546440

Publication URI: http://dx.doi.org/10.1109/estc.2018.8546440

Type: Conference/Paper/Proceeding/Abstract