Condition monitoring for solder layer degradation in multi-device system based on neural network (2019)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1049/joe.2018.8025

Publication URI: http://dx.doi.org/10.1049/joe.2018.8025

Type: Journal Article/Review

Parent Publication: The Journal of Engineering

Issue: 17