Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates (2019)
Attributed to:
Processing of nano copper materials for the production of conductive circuits
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Publication URI: https://link.springer.com/article/10.1007/s10854-019-02358-x
Type: Journal Article/Review
Parent Publication: Journal of Materials Science: Materials in Electronics
Issue: Journal of Materials Science: Materials in Electronics