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A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules (2019)

First Author: Terasaki N

Attributed to: Diffusion Bonding Titanium Alloys to Stainless Steels funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s10854-019-00961-6

Publication URI: http://dx.doi.org/10.1007/s10854-019-00961-6

Type: Journal Article/Review

Parent Publication: Journal of Materials Science: Materials in Electronics

Issue: 7