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Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications (2019)

First Author: Liu G

Attributed to: Novel GaN Power Devices and Packaging Technologies for 300C Ambient Operation funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://www.imapsource.org/loi/apap

Type: Conference/Paper/Proceeding/Abstract

Volume: 2019

Issue: HiTEN (2019)