Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications (2019)
Attributed to:
Novel GaN Power Devices and Packaging Technologies for 300C Ambient Operation
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Publication URI: https://www.imapsource.org/loi/apap
Type: Conference/Paper/Proceeding/Abstract
Volume: 2019
Issue: HiTEN (2019)