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Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module (2020)

First Author: DiMarino C

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/jestpe.2019.2944138

Publication URI: http://dx.doi.org/10.1109/jestpe.2019.2944138

Type: Journal Article/Review

Parent Publication: IEEE Journal of Emerging and Selected Topics in Power Electronics

Issue: 1