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System Integration for Plastic Electronics Using Room-Temperature Ultrasonic Welding (2020)

First Author: Dou G

Attributed to: EPSRC Centre for Innovative Manufacturing in Large Area Electronics funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/adem.201901309

Publication URI: http://dx.doi.org/10.1002/adem.201901309

Type: Journal Article/Review

Parent Publication: Advanced Engineering Materials

Issue: 5