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Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing (2018)

First Author: Wang J

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.corsci.2018.05.020

Publication URI: http://dx.doi.org/10.1016/j.corsci.2018.05.020

Type: Journal Article/Review

Parent Publication: Corrosion Science