Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing (2018)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.corsci.2018.05.020
Publication URI: http://dx.doi.org/10.1016/j.corsci.2018.05.020
Type: Journal Article/Review
Parent Publication: Corrosion Science