Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test (2018)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s10854-018-9293-8
Publication URI: http://dx.doi.org/10.1007/s10854-018-9293-8
Type: Journal Article/Review
Parent Publication: Journal of Materials Science: Materials in Electronics
Issue: 14