Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test (2018)

First Author: Mo L
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s10854-018-9293-8

Publication URI: http://dx.doi.org/10.1007/s10854-018-9293-8

Type: Journal Article/Review

Parent Publication: Journal of Materials Science: Materials in Electronics

Issue: 14