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Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates (2019)

First Author: Abbas B

Attributed to: Advanced Materials equipment refresh funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s10854-019-02358-x

Publication URI: http://dx.doi.org/10.1007/s10854-019-02358-x

Type: Journal Article/Review

Parent Publication: Journal of Materials Science: Materials in Electronics

Issue: 22