Test Structures for Developing Packaging for Implantable Sensors (2020)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tsm.2020.2987134
Publication URI: http://dx.doi.org/10.1109/tsm.2020.2987134
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Semiconductor Manufacturing
Issue: 2