Test Structures for Developing Packaging for Implantable Sensors (2020)

First Author: Blair E

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/TSM.2020.2987134

Publication URI: http://dx.doi.org/10.1109/TSM.2020.2987134

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Semiconductor Manufacturing

Issue: 2