Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics (2020)
Attributed to:
Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2020.3009156
Publication URI: http://dx.doi.org/10.1109/tcpmt.2020.3009156
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 11