Achieving Ohmic conduction behavior at high electric field via interface manipulation (2020)
Attributed to:
Equipment Account: Integrated Thin Film Deposition and Analysis System
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.apsusc.2020.146093
Publication URI: http://dx.doi.org/10.1016/j.apsusc.2020.146093
Type: Journal Article/Review
Parent Publication: Applied Surface Science