Microstructural and Micromechanical Characteristics of Tin-Based Solders Under Self-Propagating Exothermic Reaction Heating (2020)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-020-08363-9
Publication URI: http://dx.doi.org/10.1007/s11664-020-08363-9
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 10