Microstructural and Micromechanical Characteristics of Tin-Based Solders Under Self-Propagating Exothermic Reaction Heating (2020)

First Author: Zhou Z
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-020-08363-9

Publication URI: http://dx.doi.org/10.1007/s11664-020-08363-9

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 10